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  d d ata sheet product specification april 2004  discrete semiconductors  bt151x series c thyristors
 semiconductors product specification thyristors bt151x series c general description quick reference data passivated thyristors in a full pack, symbol parameter max. max. max. unit plastic envelope, intended for use in applications requiring high bt151x- 500c 650c 800c bidirectional blocking voltage v drm , repetitive peak off-state 500 650 800 v capability and high thermal cycling v rrm voltages performance. typical applications i t(av) average on-state current 7.5 7.5 7.5 a include motor control, industrial i t(rms) rms on-state current 12 12 12 a and domestic lighting, heating and i tsm non-repetitive peak 100 100 100 a static switching. on-state current pinning - sot186a pin configuration symbol pin description 1 cathode 2 anode 3 gate case isolated limiting values limiting values in accordance with the absolute maximum system (iec 60134). symbol parameter conditions min. max. unit -500c -650c -800c v drm , v rrm repetitive peak off-state - 500 1 650 1 800 v voltages i t(av) average on-state current half sine wave; t hs 69 ?c - 7.5 a i t(rms) rms on-state current all conduction angles - 12 a i tsm non-repetitive peak half sine wave; t j = 25 ?c prior to on-state current surge t = 10 ms - 100 a t = 8.3 ms - 110 a i 2 ti 2 t for fusing t = 10 ms - 50 a 2 s di t /dt repetitive rate of rise of i tm = 20 a; i g = 50 ma; - 50 a/s on-state current after di g /dt = 50 ma/s triggering i gm peak gate current - 2 a v rgm peak reverse gate voltage - 5 v p gm peak gate power - 5 w p g(av) average gate power over any 20 ms period - 0.5 w t stg storage temperature -40 150 ?c t j junction temperature - 125 ?c ak g 12 3 case 1 although not recommended, off-state voltages up to 800v may be applied without damage, but the thyristor may switch to the on-state. the rate of rise of current should not exceed 15 a/s. april 2004 1 rev 1.000
 semiconductors product specification thyristors bt151x series c isolation limiting value & characteristic t hs = 25 ?c unless otherwise specified symbol parameter conditions min. typ. max. unit v isol r.m.s. isolation voltage from all f = 50-60 hz; sinusoidal - - 2500 v three terminals to external waveform; heatsink r.h. 65% ; clean and dustfree c isol capacitance from pin 2 to f = 1 mhz - 10 - pf external heatsink thermal resistances symbol parameter conditions min. typ. max. unit r th j-hs thermal resistance with heatsink compound - - 4.5 k/w junction to heatsink without heatsink compound - - 6.5 k/w r th j-a thermal resistance in free air - 55 - k/w junction to ambient static characteristics t j = 25 ?c unless otherwise stated symbol parameter conditions min. typ. max. unit i gt gate trigger current v d = 12 v; i t = 0.1 a - 2 15 ma i l latching current v d = 12 v; i gt = 0.1 a - 10 40 ma i h holding current v d = 12 v; i gt = 0.1 a - 7 20 ma v t on-state voltage i t = 23 a - 1.44 1.75 v v gt gate trigger voltage v d = 12 v; i t = 0.1 a - 0.6 1.5 v v d = v drm(max) ; i t = 0.1 a; t j = 125 ?c 0.25 0.4 - v i d , i r off-state leakage current v d = v drm(max) ; v r = v rrm(max) ; t j = 125 ?c - 0.1 0.5 ma dynamic characteristics t j = 25 ?c unless otherwise stated symbol parameter conditions min. typ. max. unit dv d /dt critical rate of rise of v dm = 67% v drm(max) ; t j = 125 ?c; off-state voltage exponential waveform gate open circuit 50 130 - v/ s r gk = 100 200 1000 - v/ s t gt gate controlled turn-on i tm = 40 a; v d = v drm(max) ; i g = 0.1 a; - 2 - s time di g /dt = 5 a/s t q circuit commutated v d = 67% v drm(max) ; t j = 125 ?c; - 70 - s turn-off time i tm = 20 a; v r = 25 v; di tm /dt = 30 a/s; dv d /dt = 50 v/s; r gk = 100 april 2004 2 rev 1.000
 semiconductors product specification thyristors bt151x series c fig.1. maximum on-state dissipation, p tot , versus average on-state current, i t(av) , where a = form factor = i t(rms) / i t(av) . fig.2. maximum permissible non-repetitive peak on-state current i tsm , versus pulse width t p , for sinusoidal currents, t p 10ms. fig.3. maximum permissible rms current i t(rms) , versus heatsink temperature t hs . fig.4. maximum permissible non-repetitive peak on-state current i tsm , versus number of cycles, for sinusoidal currents, f = 50 hz. fig.5. maximum permissible repetitive rms on-state current i t(rms) , versus surge duration, for sinusoidal currents, f = 50 hz; t hs 69?c. fig.6. normalised gate trigger voltage v gt (t j )/ v gt (25?c), versus junction temperature t j . 02468 0 5 10 15 1.9 2.2 2.8 4 i t(av) (a) p tot (w) t hs(max) (c) 125 102.5 80 57.5 30 4 conduction angle form 60? 90? 120? 180? (a) 2.8 2.2 1.9 1.57 factor () 30? 4.0 a = 1.57 1 10 100 1000 0 20 40 60 80 100 120 number of half cycles at 50hz itsm / a t i tsm time i tj initial = 25 c max t 10 100 1000 10us 100us 1ms 10ms t / s itsm / a t i tsm time i tj initial = 25 c max t di /dt limit t 0.01 0.1 1 10 0 5 10 15 20 25 surge duration / s it(rms) / a -50 0 50 100 150 0 2 4 6 8 10 t hs ( c) i t(rms) (a) 69 c 12 14 -50 0 50 100 150 0.4 0.6 0.8 1 1.2 1.4 1.6 tj / c vgt(tj) vgt(25 c) april 2004 3 rev 1.000
 semiconductors product specification thyristors bt151x series c fig.7. normalised gate trigger current i gt (t j )/ i gt (25?c), versus junction temperature t j . fig.8. normalised latching current i l (t j )/ i l (25?c), versus junction temperature t j . fig.9. normalised holding current i h (t j )/ i h (25?c), versus junction temperature t j . fig.10. typical and maximum on-state characteristic. fig.11. transient thermal impedance z th j-hs , versus pulse width t p . fig.12. typical, critical rate of rise of off-state voltage, dv d /dt versus junction temperature t j . -50 0 50 100 150 0 0.5 1 1.5 2 2.5 3 tj / c igt(tj) igt(25 c) 0 0.5 1 1.5 2 0 10 20 30 v t (v) i t typ max (a) v o = 1.06 v r s = 0.0304 ohms t j = 125 c t j = 25 c -50 0 50 100 150 0 0.5 1 1.5 2 2.5 3 bt145 tj / c il(tj) il(25 c) 0.001 0.01 0.1 1 10 tp / s zth j-hs (k/w) 10us 0.1ms 1ms 10ms 0.1s 1s 10s t p p t d without heatsink compound with heatsink compound -50 0 50 100 150 0 0.5 1 1.5 2 2.5 3 tj / c ih(tj) ih(25 c) 0 50 100 150 10 100 1000 10000 tj / c dvd/dt (v/us) gate open circuit rgk = 100 ohms april 2004 4 rev 1.000
 semiconductors product specification thyristors bt151x series c mechanical data dimensions in mm net mass: 2 g fig.13. sot186a; the seating plane is electrically isolated from all terminals. notes 1. refer to mounting instructions for f-pack envelopes. 2. epoxy meets ul94 v0 at 1/8". 10.3 max 3.2 3.0 4.6 max 2.9 max 2.8 seating plane 6.4 15.8 max 0.6 2.5 2.54 5.08 12 3 3 max. not tinned 3 0.5 2.5 0.9 0.7 m 0.4 15.8 max. 19 max. 13.5 min. recesses (2x) 2.5 0.8 max. depth 1.0 (2x) 1.3 april 2004 5 rev 1.000
nxp semiconductors legal information data sheet status notes 1. please consult the most rece ntly issued documen t before initiating or completing a design. 2. the product status of device(s) de scribed in this document may have ch anged since this document was published and may differ in case of multiple devices. the latest product status information is available on the internet at url http://www.nxp.com. document status (1) product status (2) definition objective data sheet development this document contains data from the objective specification for product development. preliminary data sheet qualification this document contains data from the preliminary specification. product data sheet production this document contains the product specification. definitions product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer, unless nxp semiconductors and customer have explicitly agreed otherwise in writing. in no event however, shall an agreement be valid in whic h the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completene ss of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductor s be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described he rein shall be limited in accordance with the terms and conditio ns of commercial sale of nxp semico nductors. right to make changes ? nxp semiconductors reserves th e right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or wa rranted to be suitable for use in life support, life-cri tical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without furthe r testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as for the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.
nxp semiconductors legal information nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applications and products using nxp semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions sectio n (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are so ld subject to the general terms and cond itions of commercial sale, as published at http://www.nxp.com/profile/t erms, unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby express ly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconductors products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or inte llectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not complete, exhaustive or legally binding. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semiconductors produc t is automotive qualified, the product is not suitable fo r automotive use. it is neither qualified nor tested in accord ance with automotive testing or application requirements. nxp semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? spec ifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotiv e applications beyond nxp semiconductors? standard warranty and nxp semiconductors? product specifications. contact information for additional information please visit: http://www.nxp.com for sales offices addresses send e-mail to: salesaddresses@nxp.com customer notification this data sheet wa s chan ged to reflect the new company name nxp semiconductors, including new legal definitions and disclaimers. no changes were made to the content, except for the legal definitions and disclaimers. ? nxp b.v. 2011 all rights are reserved. reproduction in whole or in part is pr ohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reli able and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. printed in the netherlands


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